Lockheed Martin has developed a nanotechnology copper solder that, according to the company, can produce joints with ten times the electrical and thermal conductivity of tin-based materials, the company announced on October 24.
Kenneth Washington Lockheed Martin space systems advanced technology center’s vice president, said CuantumFuse has the potential to be used in space, defense, and commercial manufacturing applications.
Lockheed Martin said the solder will address the worldwide effort to use lead-free materials in electronics.
CuantumFuse inventor Alfred Zinn said ATC used the nano-particle approach to produce a solder paste made of pure copper.
Mike Beck, ATC advanced materials and Nanosystems group director, said CuantumFuse was recently used to assemble a small test camera board.